Most components have a maximum, effective operating temperature. Failure to maintain the temperature below this level can lead to a variation in electrical properties and overall increased failure rates. Metal heat sinks are typically connected to components which generate a large amount of thermal energy when in use. These are used to dissipate such energy away from the device to avoid failure due to over-heating. Heat sinks have proven to be very effective over the years however in order to ensure full contact and therefore maximum efficiency, thermal management products are used alongside.
Electrolube – Thermal management
Metal surfaces, even when polished to a fine degree, have a certain amount of roughness. It can therefore be deduced that when two metal surfaces are placed together contact is not 100% and there will always be an air gap between the two surfaces. The use of a thermal paste or adhesive allows such gaps to be filled ensuring complete contact between the two surfaces and in turn more efficient heat conductance.
The range of applications where the use of a thermally conductive material is necessary has greatly increased as electronic circuits have become more complex and powerful.
Introduction of Complete Range of Thermal Pads
TCOR – Thermally Conductive Oxime RTV
- Solvent free low odour RTV
- High degree of thermal conductivity 1.8 W/m.K
- Wide range of operating temperatures ( -50 degree to + 230 degree )
- Moisture cure – releasing oxime upon cure
- Remains flexible and elastic at high temperatures.
- Good chemical resistance
- Packaging available in 75ml