Most components have a maximum, effective operating temperature. Failure to maintain the temperature below this level can lead to a variation in electrical properties and overall increased failure rates. Metal heat sinks are typically connected to components which generate a large amount of thermal energy when in use. These are used to dissipate such energy away from the device to avoid failure due to over-heating. Heat sinks have proven to be very effective over the years however in order to ensure full contact and therefore maximum efficiency, thermal management products are used alongside.

Electrolube – Thermal management

Metal surfaces, even when polished to a fine degree, have a certain amount of roughness. It can therefore be deduced that when two metal surfaces are placed together contact is not 100% and there will always be an air gap between the two surfaces. The use of a thermal paste or adhesive allows such gaps to be filled ensuring complete contact between the two surfaces and in turn more efficient heat conductance.

The range of applications where the use of a thermally conductive material is necessary has greatly increased as electronic circuits have become more complex and powerful.

  • Non-silicone pastes
  • Silicone pastes
  • RTV’s
  • Epoxy
  • Accessories

Introduction of Complete Range of Thermal Pads

HTC – Non-silicone Heat Transfer Compound

  • High thermal conductivity 0.9 W/m.K
  • Wide operating temperature range -50°C to +130°C
  • Packaging available in 1Kg , 2ml ,10ml , 12.5Kg , 20ml , 25ml , 35ml , 310ml

HTCX – Heat Transfer Compound Xtra – Non Silicone

  • Very low oil bleed
  • High Thermal Conductivity 1.35 W/m.K
  • Packaging available in 35ml , 1kg

HTCP – Heat Transfer Compound Plus – Non Silicone

  • Very low oil bleed.
  • Excellent thermal conductivity 2.5W/m.K
  • Packaging available in 20ml , 1kg , 25kg , 700kg

HTCPX – Non-Silicone Heat Transfer Compound PLUS Xtra

  • Highest Thermal Conductivity 3.42 W/m.K
  • Packaging available in 700ml , 25kg

HTS – Silicone Heat Transfer Compound

  • Wide operating temperature range -50°C to +200°C
  • Excellent thermal conductivity even at high temperatures 0.9 W/m.K
  • Packaging available in 1Kg , 2ml ,10ml , 25Kg , 30ml , 35ml , 700g

HTSP – Silicone Heat Transfer Compound Plus

  • Superior thermal conductivity even at high temperatures 3.0 W/m.K
  • Wide operating temperature range -50°C to +200°C
  • Packaging available in 50ml tube , 35ml syringe , 1Kg , 10Kg , 25Kg

TCOR – Thermally Conductive Oxime RTV

  • Solvent free low odour RTV
  • High degree of thermal conductivity 1.8 W/m.K
  • Wide range of operating temperatures ( -50 degree to + 230 degree )
  • Moisture cure – releasing oxime upon cure
  • Remains flexible and elastic at high temperatures.
  • Good chemical resistance
  • Packaging available in 75ml

TCER – Thermally Conductive Ethoxy RTV

  • Single part, low odour RTV
  • High thermal conductivity 2. 2W/m.K
  • Operating Temperature range -50 to +230 degrees
  • Remains flexible and elastic at high temperatures
  • Good electrical insulation characteristics
  • Packaging available in 75ml

TBS – Thermal Bonding System

  • Two part epoxy bonding system with thermal conductivity of 1.1 W/m.K
  • Eliminates need for mechanical fixing by providing a permanent bond
  • Cures at room temperature
  • Packaging available in 20ml syringe , 1Kg